
Foil Laminated Glass Textile Material SF for PCB Manufacturing
Manufacturer:ELEKTRORESOURCE OJSC
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FOB, CIF & EXW terms available
Description
Foil materials faced with copper electrolytic electroplating foil are designed for the manufacture of single and double-sided printed circuit boards by chemical and combined (negative or positive) methods. They are produced in thickness from 0,5 to 3 mm
Specifications
Application temperature
85 °C
Thickness
0.5...3 mm
Foil thickness
35 µm; 50 µm
Dimensions
640...490 mm
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Delivery Time
Sea freight: 30-60 days (depending on destination) Air freight: 14-21 days (for urgent orders)
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