Diksal-3N Adhesive for Semiconductor Components Assembly

Diksal-3N Adhesive for Electronic Component Assembly in Semiconductor Manufacturing

Manufacturer: CKB RM OJSC
Price: Request Quote

Bulk pricing available

FOB, CIF & EXW terms available

Description

The adhesive is designed for assembly of electronic components in the production of semiconductor devices and integrated circuits, for seating crystals on the heat sink to provide electrical insulation. The operating temperature range is from minus 60 to plus 200 oÑ.

Specifications

Type of product according to PP RF 616
Adhesives
Shear strength at pair (steel-steel), not less
9 MPa
Viability, not less
72
Spreading
19...25 mm
Packaging
Glue is packed in glass jars with a neck under the lid with a screw thread with a capacity of 50-500 cm3. Packaging in ABS plastic jars is allowed.
Color
Homogeneous paste of white colour
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Delivery & Payment

Shipping Terms

FOB Novorossiysk, Russia CIF Available to major ports worldwide EXW Manufacturer's facility, Russia

Delivery Time

Sea freight: 30-60 days (depending on destination) Air freight: 14-21 days (for urgent orders)

Payment Methods

Letter of Credit (L/C) Wire Transfer (T/T) Escrow Services

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