High-Reliability Processor Module for Embedded Systems - CPC1311-02

High-Reliability Processor Module CPC1311-02 for Embedded Applications

Manufacturer: DOLOMANT OJSC
Price: Request Quote

Bulk pricing available

FOB, CIF & EXW terms available

Description

The CPC1311 processor module is made in COM Express mini standard, Type 10.55 x 84 mm. based on Intel Atom E3845/ E3825 processors and is designed for building highly reliable embedded power-efficient systems with small overall dimensions. The CPC1311 complies with the "PICMG COM.0 COM Express Module Base Specification Revision 2.1"

Specifications

Software compatibility with OS
Linux 3.8.0; QNX 6.6; Microsoft Windows Embedded Standard 8; Microsoft Windows Embedded Standard 7
Weight
max. 0.15 kg
Power consumption
12 W
Nutrition
From COM Express connector with extended range (4.75 V ... 20 V)
Operating temperature range
Minus 40 to plus 85C; (temperature control on the heat spreader plate)
FLASH BIOS
64 Mbit SPI-Flash; System modifiability
Watchdog timer
1.2 sec ...10 min
Real Time Clock
Armoured glass
COM Express COM.0 Type 10 connector
3(4) PCIe x1 ports (PCIe Base Spec. Rev 2.0), 5 GT/s; 4xUSB 2.0 (host), 1xUSB 2.0 (client), 1xUSB 3.0 SuperSpeed (host); 2xSATA II ( 3-Gbps Gen. II); 1xGbit Ethernet; 1xSPI (External Boot); 1xLVDS/eDP; Digital Display Interface DDI0 2560x1600 @ 50Hz; 1x
FRAM 8 Kbytes (I2C port)
To store the configuration
RAM
2 GB 1066 DDR3L
Processor
Intel Atom E3825: 1.33 GHz, 2 cores

Note: All specifications are provided by the manufacturer and may be subject to change. Please contact us to confirm the latest specifications before placing your order.

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Delivery & Payment

Shipping Terms

FOB Novorossiysk, Russia CIF Available to major ports worldwide EXW Manufacturer's facility, Russia

Delivery Time

Sea freight: 30-60 days (depending on destination) Air freight: 14-21 days (for urgent orders)

Payment Methods

Letter of Credit (L/C) Wire Transfer (T/T) Escrow Services

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