High Thermal Conductivity Gasket TP-6 for Effective Heat Management

Highly thermally conductive dielectric gasket material based on special fillers (TP-6) with thermal conductivity coefficient not less than 5,0W/(mK) is designed for heat dissipation from heated elements in electronic equipment, radio engineering and instrumentation.It is a silicone gasket 0,5-3,0 mm thick, obtained by curing of silicone binder filled with highly thermally conductive fillers. It is supplied in the form of 230x230 mm plates