Microfocus X-ray Inspection System SRK-1000 for Non-Destructive Testing of Components

Purpose: Non-destructive quality control of welded, soldered joints of REA components of product categories: <ul> <li>- BGA-cases and integrated circuits</li> <li>semiconductor packages</li> <li>shielded devices, encapsulated components, complete modules</li> <li>integrated circuits with multi-level chipping</li> <li>printed electronics, hidden connections</li> <li>bare boards, multilayer boards</li> <li>power modules</li> </ul> Design features: <ul> <li>- presence of control and indication organs</li> <li>protective earthing</li> <li>convenient access to the elements involved in the process of operation</li> <li>maximum size of the investigated object - 440x550 mm.</li> <li>maximum weight of the investigated object - 5 kg.</li> <li>power supply from AC 230 V, 50 Hz.</li> </ul> Advantages: Domestic products, in-house service and spare parts