
Oratoria 9-1 Vacuum Coating System for Advanced Thin Film Applications
Manufacturer:
KVARZ OJSC
Price:
Request Quote
Bulk pricing available
FOB, CIF & EXW terms available
Description
Oratorium 9-1 vacuum deposition machine
Automated installation "Oratoria 9-1" electron-beam deposition of multilayer thin films of metals, alloys and dielectrics on ceramic and silicon wafers.
The main technological characteristics of the unit are:
-Size of ceramic wafers, mm - 60x48;
-Size of silicon wafers with diameter, mm - 100;
-Number of wafers on the planetary carousel, pcs - 4;
-Number of wafers on the spherical carousel, pcs - 40;
-Number of electron-beam evaporators, pcs - 2;
-Range of substrates heating temperature - 20-400 degrees Celsius;
-Rotation of the carousel is discrete (angle of discretion 90 degrees).
The unit provides:
-Heating of substrates up to the set temperature, control and maintenance of temperature in the process of layer sputtering;
-Automatic execution of the cycle of pumping the working chamber from the atmosphere to the specified vacuum;
-Control and automatic termination of film sputtering according to the set time or the set film thickness...
Automated installation "Oratoria 9-1" electron-beam deposition of multilayer thin films of metals, alloys and dielectrics on ceramic and silicon wafers.
The main technological characteristics of the unit are:
-Size of ceramic wafers, mm - 60x48;
-Size of silicon wafers with diameter, mm - 100;
-Number of wafers on the planetary carousel, pcs - 4;
-Number of wafers on the spherical carousel, pcs - 40;
-Number of electron-beam evaporators, pcs - 2;
-Range of substrates heating temperature - 20-400 degrees Celsius;
-Rotation of the carousel is discrete (angle of discretion 90 degrees).
The unit provides:
-Heating of substrates up to the set temperature, control and maintenance of temperature in the process of layer sputtering;
-Automatic execution of the cycle of pumping the working chamber from the atmosphere to the specified vacuum;
-Control and automatic termination of film sputtering according to the set time or the set film thickness...
Specifications
Width
3650 mm
Length
3500 mm
Share your requirements for a quick response!
Instant response in 15 minutes
Best wholesale prices guaranteed
Direct from manufacturer
Delivery & Payment
Shipping Terms
Delivery Time
Sea freight: 30-60 days (depending on destination)
Air freight: 14-21 days (for urgent orders)
Payment Methods
Similar Products You May Be Interested In

Plasma Chemical Etching Vacuum System with ICP Source and Cassette Loading TM 300
View Details
Plasma Chemical Anisotropic Selective Etching System Plasma TM 200-01
View Details
Solder Paste Melting Oven with Ethernet Control - Raduga 11
View Details
Vacuum Coating System for Metallic Films Oratoria 29M
View Details
Compact Vacuum Coating System for Magnetron Sputtering, Model MVU Magna 12
View Details
Plasma Etching Vacuum System with ICP Plasma Source TM 9
View Details
Magnetron Sputtering Vacuum Coating System Magna TM 22
View Details
Plasma-Chemical Deposition Vacuum System with ICP Source - Izofaz TM 200-01
View Details
Photolithography Cluster Line - Advanced Processing Modules
View Details
Electronic Component Cleaning Machine for PCB Assembly
View Details
Deep Anisotropic Etching Vacuum System MVU TM PLASMA 06
View Details
Vacuum Coating System UVN-71P-3M-1
View DetailsVerified Suppliers
All products are sourced directly from authorized Russian manufacturers
Quality Assurance
Products meet international quality standards with proper certification
Global Shipping
Reliable logistics solutions to deliver products to your location
Secure Payments
Multiple secure payment options to facilitate international transactions