Dielectric of FDI-AP-50 mark, SYUO.037.042 TU

FDI-AP-50 - lacofoil dielectric polyimide on aluminium foil is designed for manufacturing of frames with aluminium leads of coreless integrated circuits of modification 2 and flexible printed circuits by photochemical method. The dielectric subjected to thermal imidisation can work in the temperature range from minus 60 to plus 200 oC within 1000 h.