Available for Import
Main Processor Board for Modular Electronic Devices UTINET Nordvik - Dual CPU Connection
Manufacturer:
COMPUTERPROF LLC
Price:
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Bulk pricing available
FOB, CIF & EXW terms available
Description
The product is intended for use as the main printed circuit board of a modular electronic device, for example, a server.
The product provides:
Connection of 2 Intel Xeon Scalable Processors with calculated TDP (Thermal Design Power) up to 205W
Mechanical and electrical connection to the processor - Skylake EP LGA3647
Connection up to 24 DIMM DDR4 2666 MHz RAM modules
SATA M.2 hard drive connection
Connection of management subsystem with USB, LAN, SATA interfaces
Connection of up to 8 PCIe x8 interfaces or 4 PCIe x16
The product provides:
Connection of 2 Intel Xeon Scalable Processors with calculated TDP (Thermal Design Power) up to 205W
Mechanical and electrical connection to the processor - Skylake EP LGA3647
Connection up to 24 DIMM DDR4 2666 MHz RAM modules
SATA M.2 hard drive connection
Connection of management subsystem with USB, LAN, SATA interfaces
Connection of up to 8 PCIe x8 interfaces or 4 PCIe x16
Specifications
Processor
Intel® Xeon® Scalable 1st, 2nd, Ref Generation
Frequency
1700...4200
RAM TYPE
DDR4 ECC REG
RAM capacity
8192...4096000
Video controller
Armoured glass
HDMI 1.4
1 pcs
1G Ethernet
6 pcs
RS-232
1 pcs
Energy consumption
450...3600 W
GPIO
8 pcs
Number of processors
2 pcs
Peak performance
850
PCI Express x16
4 pcs
PCI Express x8
8 pcs
10G ETHERNET
2 pcs
Number of cores
4...28 pcs
Availability of video connectors
VGA
CPU connector
FCLGA3647
Chipset
C621, C622, C624
Note: All specifications are provided by the manufacturer and may be subject to change. Please contact us to confirm the latest specifications before placing your order.
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Shipping Terms
Delivery Time
Sea freight: 30-60 days (depending on destination)
Air freight: 14-21 days (for urgent orders)
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