Multilayer and Double-Sided Printed Circuit Board Manufacturing for Electronics

"Single-sided (thickness 0,2-3,0 mm), double-sided (thickness 0,2-3,0 mm), multilayer (up to 26 layers, thickness 0,4-3,0 mm), prefabricated multilayer, double-sided for microwave, through hole metallisation, direct metallisation. Realised characteristics: a) minimum dimensions: conductor/gap - 0.1/0.1 mm, b) minimum diameter of metallised holes - 0,10 mm, c) minimum guarantee belt - 0,025 mm, d) ratio of hole diameter/board thickness - 1:10, e) finishing coatings: galvanic and chemical gold, HAL (PIC-63), galvanic nickel plating, local galvanic gilding of the circuit, protective solder mask - liquid two-component composition ELPEMER GL2467 by PETERS. Manufacturing control: automated optical control, electrical control, impedance control.

Printed circuit board production technology includes: <ol> <li>automated design.</li> <li>High-precision drilling and milling equipment.</li> <li>Digital photolithography (patternless tech...</li> </ol>.