Available for Import
Ultrasonic Thermosonic Spot Welding Machine UMC-20KPM for Gold Wire Micro Welding
Manufacturer:
ECO-TECH MICROELECTRONICS LLC
Price:
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FOB, CIF & EXW terms available
Description
The microwelding unit is designed for ultrasonic, thermosonic and contact microwelding of gold wire by the method of "ball-and-wedge", "wedge-and-wedge".
The main technological feature of the unit is that thermosonic welding of gold wire on the board by the method of "wedge", as well as "ball" can be carried out with simultaneous superimposition of microcontact welding (if you choose this operation of work on the unit), which allows you to install jumpers - micro welding on the contact pads of the following materials: on which there may be organic contaminants (for example: flux residues after maintenance), on immersion gold, on printed circuit boards, on aluminium, on nickel, on the contact pads of the following materials: on which there may be organic contaminants (for example: flux residues after maintenance), on immersion gold, on printed circuit boards, on aluminium, on nickel, on the contact pads of the following materials.
The main technological feature of the unit is that thermosonic welding of gold wire on the board by the method of "wedge", as well as "ball" can be carried out with simultaneous superimposition of microcontact welding (if you choose this operation of work on the unit), which allows you to install jumpers - micro welding on the contact pads of the following materials: on which there may be organic contaminants (for example: flux residues after maintenance), on immersion gold, on printed circuit boards, on aluminium, on nickel, on the contact pads of the following materials: on which there may be organic contaminants (for example: flux residues after maintenance), on immersion gold, on printed circuit boards, on aluminium, on nickel, on the contact pads of the following materials.
Specifications
Type of product according to PP RF 616
Contact spot welding machine
Minimum welding current
15 A
Power
Built-in memory card slot, support microSD/SDHC/SDXC card (up to 256GB); manual recording/alarm recording kW
Maximum power consumption, kW
Built-in memory card slot, support microSD/SDHC/SDXC card (up to 256GB); manual recording/alarm recording
Dimensions
500x700x370 mm
Weight
55 kg
Operating modes (continuous/pulse)
continuous/pulse
Length
500 mm
Width
700 mm
Frequency of supply voltage
SBVVBG
Automatic welding
Armoured glass
Semi-automatic welding
Armoured glass
Mains frequency
SBVVBG
Height
370 mm
Weight
30...55 kg
Welding head drive stroke in the X axis
20 mm
Y-axis travel of the slide drive system
20 mm
Z-axis travel of the weld head drive unit
Built-in memory card slot, support microSD/SDHC/SDXC card (up to 256GB); manual recording/alarm recording mm
Output power control range of the ultrasonic generator
3 W
Welding time adjustment range
0.1...1
Programmable compression force for connecting elements
5
Height of height difference of the contact pads
5 mm
Ultrasonic transducer reach (length)
100...165 mm
Resonant frequency of ultrasonic oscillations of piezoceramic transducer
62
Maximum slide heating
250 °C
Adjusting the height of the work table
10 cm
wire thickness
8 mm
wire material
gold aluminium
Note: All specifications are provided by the manufacturer and may be subject to change. Please contact us to confirm the latest specifications before placing your order.
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