
Unified Design for Electronic Device - Ideal for Modular Applications
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FOB, CIF & EXW terms available
Description
The unified design consists of assemblies including the housing, covers, chassis for mating parts of module connectors, brackets for shock absorbers or housing mounting feet. It is envisaged to create devices of 9 standard sizes of 230, 250, 300, 325, 375, 375, 425, 470 and 500 mm in length with variants of fastening body on both short and long sides of the body, with the possibility of using two types of shock absorbers or without them. Development of devices based on unified designs: <ol> <li>Dramatically reduces the time and labour intensity of development;</li> <li>Provides reduction of labour intensity of parts and assemblies manufacturing due to limitation of standard sizes of devices, unified zones of output connectors placement;</li> <li>Reduces labour intensity of manufacturing of test equipment and test processes;</li> </ol>provides high standardisation and unification rates; <ol> <li>Simplifies operation and utilisation of the equipment</li> <li>It is designed to place modules on printed circuit boards with overall dimensions 170 x 210 mm with connectors of SNP260 type BSAR.434410.003TU.</li> </ol>Devices based on unified designs are intended for use in aircraft, mobile and stationary ground complexes, marine facilities, routine mobile and stationary systems, as well as for electronic devices of national and economic purpose operated also under increased requirements for mechanical and climatic effects.
Specifications
Note: All specifications are provided by the manufacturer and may be subject to change. Please contact us to confirm the latest specifications before placing your order.
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