High Thermal Conductivity Insulating Pad TП-8 for Efficient Heat Transfer

Highly thermally conductive dielectric gasket material based on special fillers (TP-8) with thermal conductivity coefficient not less than 3,5W/(mK) is designed for heat dissipation from heated elements in electronic equipment, radio engineering and instrumentation.It is a silicone gasket of thickness 0,38; 0,5; 1,0; 1,0; 1,5; 2,0; 3,0; 4,0 mm, obtained by curing of silicone binder filled with highly thermally conductive fillers and at the customer's request it can have a sticky layer both on one and two sides. It is supplied in the form of 230x230 mm plates.