
Thin Film Deposition System for Metals, Alloys, and Dielectrics - Advanced Application
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FOB, CIF & EXW terms available
Description
Realised application technologies: -magnetron application of thin films: -metals, resistive alloys, other conductive materials; -dielectrics by reactive sputtering; -dielectric materials by high-frequency magnetron sputtering. Other methods of thin film deposition are: -thermal evaporation using a resistive evaporator; -thermal evaporation using electron heating (ring cathode); -ion-beam sputtering The units provide: stabilisation of the set flow rate of process gases on three channels and control of gas flow rate on each channel; automatic execution of programmes "from loading to unloading". The units can be equipped with a set of technological devices: magnetrons, ion sources, thermal vaporisers, ion sputtering devices and heaters. The technology can be tested and subsequently transferred It can be transferred to the ordered installation under the Customer's technology.
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